EMULATION TECHNOLOGY Industrial Partner

Products

Part# Description Make Avail. Price Qty.  
FP-2BL-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-2BL-2 FP-2BL-2, MICRO GRIPPER 0.8-0.5MM PITCH EMULATION TECHNOLOGY Available request quote request quote
FP-2C-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-2CL-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-2S-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-7C-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-7CL-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-HP-1 IC Socket Test Clip; Number of Contacts:2; Leaded Process Compatible:Yes; Peak Reflow Compatible (26 EMULATION TECHNOLOGY Available request quote request quote
FP-HR-1 IC Socket Test Clip; Number of Contacts:2; Leaded Process Compatible:Yes; Peak Reflow Compatible (26 EMULATION TECHNOLOGY Available request quote request quote
FP-LA1C-10 IC Socket Test Clip EMULATION TECHNOLOGY Available request quote request quote
FP-T23-04 MICROCLIP FOR 0402 COMPONENTS EMULATION TECHNOLOGY Available request quote request quote
FP2B/064-PRB-2 Test Probe; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No EMULATION TECHNOLOGY Available request quote request quote
FP2B/GRP1-PRB-2 Test Probe; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No EMULATION TECHNOLOGY Available request quote request quote
FP2BL/GRP1-PRB-2 Test Probe; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No EMULATION TECHNOLOGY Available request quote request quote
FP2S/064-PRB-2 Test Probe; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No EMULATION TECHNOLOGY Available request quote request quote
FP2S/GRP1-PRB-2 Test Probe; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No EMULATION TECHNOLOGY Available request quote request quote
H-2303-03-9017-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-2503-01-9031-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-2703-05-9000-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-2705-05-9018-05-A CONNECTOR EMULATION TECHNOLOGY Available request quote request quote
H-3503-07-9038-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-3753-07-9015-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-4003-07-9040-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-4253-09-9020-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote
H-4503-07-9016-05-A Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 EMULATION TECHNOLOGY Available request quote request quote